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It is designed for all current and future package types, using any type of pelletized molding compound. The Fico AMS-i is a fully automatic molding system.

Top edge molding (low viscosity compounds).

The Fico AMS-LM Top Foil can handle substrates of up to 102 x 280 mm and can handle all current single sided packages. The use of top foil eliminates an extra cleaning process step after molding. As a result, the die stays clear of compound.

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The unique Top Foil feature on this machine allows bleed free production of bare die products.Top FoilA special foil, guided over the top mold, creates a soft sealing layer between mold and products. In line with the market trend of larger substrates, Besi Netherlands has introduced a new large substrate molding machine with Top Foil functionality, to mold single sided MAP products like BGA, QFN and BOC.

Individual, equal board clampingPellet Supply.

Dynamic Clamping Control (Flip Chip Bare Die).

Topedge molding (low viscosity compounds).

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Optical Character Verification (OCV)Leadframe Handler.

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Bar code and RFID reader (optional)Vision.

The Fico AMS-LM can handle substrates of up to 102 x 280 mm and can handle all current single sided packages.Large substrates allow a high board utilisation and in combination with the high output of the Fico AMS-LM, performance and yield increase significantly. In line with the market trend of larger substrates, Fico has introduced a new large substrate molding machine. By making use of the original molds, new products can be developed and optimized prior to large scale production.

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The manual machine is especially developed for offline cleaning and molding process parameter optimization. The Fico Process Technology and Engineering department are ready to assist you in the design of your final package, in optimizing your process parameters, process reliability, process costs and selection the most suitable molding solution for your applications Automatic and ManualBesides automatic machines for high volume production, manual machines are available that can run production with the same molds. On top of this, our process knowledge and process support assists you in improving your current processes and help you with the introduction of new packages. Fico molding systems significantly increase yields whilst keeping cost of ownership low.

For all these new specific applications Besi Netherlands offers the best solution and equipment for your requirements. Driving forces as cost, performance and form factor are pushing molding into a new type of packages and interconnections such as Flip Chip, Exposed Die, Stacked Die and System In Package, with carriers as BGA and QFN. Based on experience, dating back several decades, each system has been designed to meet the challenges of today’s ever more demanding manufacturing processes. The Fico molding range of automatic and manual molding systems have a proven reputation for innovation, quality, reliability and high volume output. Through Silicon Vias (TSV) - Entry ticket to the future.Advanced Chip to Wafer - Cost effective dual die stacking.Fan-Out Wafer Level Packages - Highest performance for lowest cost.Long-term stability - Securing high yield at high speed Wafer Level Applications.Local reflow - Mastering sophisticated assemblies.3 Sigma - For fine-pitch and TSV applications.Tape & Reel Highest Accuracy - Capturing Tomorrow's Markets.Face - down & Face-up (recipe controlled).300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier.

Customized features - Exactly tailored for your process.

Leadframe, strip, boat, wafer - No limits for your substrates.

Thermo - compression - No limits for your applications.

Extra Speed up to +40%Enhanced Capabilities - Ready for the Future.

Waffle pack feeders - Extend your possibilities.

Single pass is king - Improve your Cpk for multi-FC packages.

Multi-chip capability - Flexibility on smallest footprint.

It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs.Multi-Chip - Combining Speed, Flexibility and Accuracy Highest Productivity for FO-WLPAs a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level.

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Factory Connectivity & Automation software.

Hermetic Sealing Systems and Package Lidders.